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THERM-A-SHEET
Low Thermal Resistance
Phase-Change Interface
Material Pads
UTEC'S
Therm-A-Sheet, phase-change
materials are formulated for use with
high performance components requiring
minimal thermal resistance for maximum
heat transfer efficiency. They combine
the easy handling advantages of
elastomeric pads with the low
thermal impedance of thermal grease,
making Therm-A-Sheet materials an
ideal choice for today's most demanding
thermal management applications:
Microprocessors
IGBTs
Solid State Relays
Memory
Modules
Power Modules
Bridge Rectifiers
DC/DC
Converters
Power Semiconductors
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| DESCRIPTION |
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Therm-A-Sheet materials are thermally enhanced polymers designed
to minimize
the thermal resistance between power dissipating electronic
components and
their associated heat sinks.This low thermal resistance path
maximizes heat sink
performance and improves the reliability of microprocessors,
memory modules,
DC/DC converters and power modules.
The Key feature of Therm-A-Sheet materials is their phase-change
characteristic.
At room temperature, Therm-A-Sheet materials are solid and
easy to handle.
This allows them to be consistently and cleanly applied as
dry pads to a heat sink
or component surface. Therm A-Sheet material softens as it
reaches component-
operating temperatures. With light clamping pressure it will
readily conform to
both mating surfaces, similar to thermal grease. This ability
to completely fill
interfacial air component packages and heat sinks allows Therm-A-Sheet
pads
to outperform non flowing elastomeric or graphite-based thermal
pads and
achieves performance comparable to thermal grease (see figure
1).
Therm-A-Sheet materials are electrically non conductive. However,
since
metal-to-metal contact is possible after the material undergoes
phase-change
in a typical heat sink assembly. Therm-A-Sheet pads should
not be used as
electrical insulators.
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APPLICATION
AND PERFORMANCE
Therm-A-Sheet
pads can be supplied
with pressure-sensitive
adhesive (PSA)
for easy pre-application to heat sinks.
Contact your heat sink supplier or UTEC
for further information. Since PSAs
tend to increase thermal impedance,
non-PSA versions are also available
for improved thermal performance.
Most heat sink suppliers have the
capability to "eat flux" non-PSA
Therm-A-Sheet pads in place onto
their heat sinks. |
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Each
Therm-A-Sheet material has been designed to perform best
within a specified
clamping pressure range. See next page for the recommended material
for some
common applications.
Therm-A-Sheet materials are not structural adhesives and should
not be used to
mechanically attach heat sinks to processors. Clips or other mechanical
fasteners
must be used to maintain heat sink to component clamping pressure.
Due to the "grease-like" behavior of the material, actual
thermal impedance in a
specific application cannot be determined using only the material's
bulk thermal
conductivity unless the actual operating pressure, temperature,
thickness, etc. are
known. Therefore, to account for the unique situations associated
with specific
applications, UTEC recommends customer testing to validate performance.
Contact
UTEC Applications Engineering at 603-579-5764 for assistance or
further information.
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| Therm-A-Sheet
Low Thermal Resistance Phase-Change Interface Pads |
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